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5.0V 10 Gb/s TIA
PRELIMINARY DATA SHEET - Rev 2 FEATURES
* * * * * 10 Gb/s Differential Output TIA +5V Power Supply Low Group Delay Small Size: 0.95mm x 1.014mm 340mW (typ) power dissipation
IIN VOUT GND VCC GND
ATA7601
APPLICATIONS
* * * SONET OC-192 10 Gb/s DWDM 10 Gb/s Ethernet
VOUT GND
CEXT
GND
GND
D1 Die Package PRODUCT DESCRIPTION
The ANADIGICS ATA7601D1 is a 5V high-speed transimpedance amplifier (TIA) for 10 Gb/s applications available in bare die form and manufactured using an InGaP HBT process. The device is used in conjunction with a
VCC VBIAS
photodetector to convert an optical signal into a differential voltage that must be AC coupled to a post amplifier. With its low input noise, a sensitivity of better than -19dBm (BER <10-10) can be achieved with the ATA7601D1.
VOUT
IIN
VOUT
CEXT
Figure 1: Circuit Block Diagram
06-01
ATA7601
292m 245m
GND
VCC
GND
189m
Die Size: 950m x 1014m Die Thickness: 178m Backside Metal Thickness: 5m IIN Pad Size: 114m x 114m unless otherwise noted Pad Pitch: 150m unless otherwise noted VOUT
VOUT
GND
225m
CEXT
GND
GND
353m
183m
Figure 2: Die Size and Layout
Table 1: Pad Description
PAD V CC IIN C EXT VOUT VOUT D ESC R IPTION Posi ti ve Supply Voltage TIA Input C onnecti on for an external C apaci tor TIA Output Voltage (Non-i nverted) TIA Output Voltage (i nverted) +5.0V Photocurrent i nput Sets the low frequency cutoff Logi cal '1' wi th opti cal i nput Logi cal '0' wi th opti cal i nput C OMMEN T
2
PRELIMINARY DATA SHEET - Rev 2 06-01
ATA7601
ELECTRICAL CHARACTERISTICS
Table 2: Absolute Maximum Ratings
PAD V CC IIN TS C OMMEN T 7.0V 3mApp Storage Temp -65 C to 125 C
Table 3: Recommended Operating Conditions
PAR AMETER Operati ng Voltage Range Operati ng Temperature Range(1) D i e Attach Temperature MIN +4.75 -10 TYP +5.0 MAX +5.25 85 260 U N IT V
O O
C C
The device may be operated safely over these conditions; however, parametric performance is guaranteed only over the conditions defined in the electrical specifications. 1. Defined at the interface between the die and the substrate.
Table 4: DC Electrical Specifications
PAR AMETER Input Offset Voltage Output Offset Voltage Supply C urrent Power D i ssi pati on
MIN
TYP 1.35 3.0 68 340
MAX
U N IT V V
95 525
mA mW
PRELIMINARY DATA SHEET - Rev 2 06-01
3
ATA7601 Table 5: AC Electrical Specifications (2)
PAR AMETER Small Si gnal D i fferenti al Transresi stance (RL - 100W ) Bandwi dth (-3dB) Low Frequency C utoff (3) Group D elay (1MHz to 8GHz) Opti cal Sensi ti vi ty (4) Input Noi se C urrent (RMS) (5) Opti cal Overload
(4) (6)
MIN 800 8.0
TYP 1000 9.0 30
MAX
U N IT
W
GHz kHz +25 ps dB m 1.8
mA
-25 -19
-3
-2 400 525 700
dB m
mA
Input C urrent at whi ch Output Li mi ts
Maxi mum D i fferenti al Output Voltage Output Return Loss (1MHz to 10GHz) 10
mV dB
2. The specifications are based upon the use of a PIN photodetector with a responsivity at 1550nm of 0.8A/W and a capacitance of CDIODE + CSTRAY = 0.3pF max connected to IIN via a 0.8nH bond wire. 3. With the use of an external capacitor. 4. Measured at 10-10 BER with a 223 -1 PRBS at 10Gb/s. 5. 11GHz bandwidth. 6. Defined as 80% of the maximum output voltage.
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PRELIMINARY DATA SHEET - Rev 2 06-01
ATA7601
PERFORMANCE DATA
Figure 3: External Capacitor Required for Low Frequency Cutoff
10000
1000
Cext (pF)
100 10 0 50 100 150 200 250 300 350 400
Low Frequency Cutoff (kHz)
Figure 4: Differential Output Voltage vs. Input Current
600
500
Output Voltage (mVpp)
400
300
200
100
0 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300
Input Current (uApp)
PRELIMINARY DATA SHEET - Rev 2 06-01
5
ATA7601 Figure 5: Eye Diagram with an Optical Input Power of -19dBm
10mV/Div.
25ps/Div.
Figure 6: Eye Diagram with an Optical Power of -9dBm
40mV/Div.
25ps/Div.
Figure 7: Eye Diagram with an Optical Input Power of -2dBm
100mV/Div.
25ps/Div.
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PRELIMINARY DATA SHEET - Rev 2 06-01
ATA7601 APPLICATION INFORMATION
Photodiode bypass MIM capacitor
VBIAS VCC
1nF bypass MIM capacitor
1nH typical
0.1F DC blocking capacitor
VOUT (50)
Photodiode
ATA7601D
CEXT
VOUT (50)
0.1F DC blocking capacitor 0.8nH typical 1nF MIM capacitor RF and DC ground plane
Figure 8: Bonding Diagram
PRELIMINARY DATA SHEET - Rev 2 06-01
7
ATA7601 Packaging The ATA7601D1 is provided as bare die. For optimum performance, the die should be packaged in a hermetic enclosure and a low inductance ground plane should be made available for power supply bypassing and ground bonds. When packaging the ATA7601D1, the temperature of the die must be kept below 260C to ensure the device reliability. The ATA7601D1 has backside metal and can be epoxy mounted or solder attached. A good thermally conductive, silver filled epoxy is recommended for epoxy mounting. If a solder attach is being used, the die attach temperature must be kept less than 260C to ensure the device reliability. A soft silicon/rubber tip collet or pyramidal collet should be used for die mounting, although tweezers can be used with extreme care. Thermosonic ball bonding, at a stage temperature of 150 to 175C with 1 to 1.3 mil gold wire, is the recommended interconnect technique. The bond force, time and ultrasonic power are all critical parameters and may require optimization to achieve the correct bond without causing bonding pad delamination or damage under the bonding pad. The bond wire from the photodetector to IIN should be made as short as possible. As the inductance of this connection increases beyond 1nH, more gain peaking will occur and the group delay performance will degrade. Output Connections The ATA7601D1 provides a differential output that must be AC coupled to the next stage of the receiver as the output buffer is not designed to drive a DC coupled 50W load. For single-ended applications, one output of the ATA7601D1 must be AC terminated to a 50W load. CEXT Connection In order to achieve the desired low frequency cutoff, an external capacitor is required. A low inductance surface mount chip capacitor or MIM capacitor is recommended. Sensitivity Measurement The typical sensitivity, as specified in the AC characteristics, is 19.0dBm. This was measured at a BER of 10-10 with a 10Gb/s, 223-1 PRBS, using a lensed single mode fiber with the photodetector and TIA in an open test fixture under the following conditions: 8
Photodetector active area: 32mm Photodetector capacitance: 0.2pF Photodetector responsivity: 0.80A/W Lensed fiber beam width: 13mm (86.5% of contained power) Lensed fiber focal distance: 3mm When the photodetector and TIA are packaged in a hermetic enclosure, with the fiber optimally aligned to the active area of the photodiode, an improvement in sensitivity should be observed. Device Modeling and Simulation S-parameter files of the TIA are available on the ANADIGICS web site (http://www.anadigics.com) or upon request. Also included on the web-site is a virtual sample. This is an encrypted model of the TIA that can be downloaded into the ADS simulation environment.
PRELIMINARY DATA SHEET - Rev 2 06-01
ATA7601
NOTES
PRELIMINARY DATA SHEET - Rev 2 06-01
9
ATA7601
NOTES
10
PRELIMINARY DATA SHEET - Rev 2 06-01
ATA7601
NOTES
PRELIMINARY DATA SHEET - Rev 2 06-01
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ATA7601
ORDERING INFORMATION
PAR T N U MB ER ATA7601D 1C PAC K AGE OPTION D1 Die PAC K AGE D ESC R IPTION
ANADIGICS, Inc. 141 Mount Bethel Road Warren, New Jersey 07059, U.S.A Tel: +1 (908) 668-5000 Fax: +1 (908) 668-5132 http://www.anadigics.com Mktg@anadigics.com
IMPORTANT NOTICE ANADIGICS, Inc. reserves the right to make changes to its products or to discontinue any product at any time without notice. The product specifications contained in Advanced Product Information sheets and Preliminary Data Sheets are subject to change prior to a products formal introduction. Information in Data Sheets have been carefully checked and are assumed to be reliable; however, ANADIGICS assumes no responsibilities for inaccuracies. ANADIGICS strongly urges customers to verify that the information they are using is current before placing orders. WARNING ANADIGICS products are not intended for use in life support appliances, devices, or systems. Use of an ANADIGICS product in any such application without written consent is prohibited. PRELIMINARY DATA SHEET - Rev 2 06-01
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